Keyword stress
Thermomechanical warpage and stress analysis of chiplet-integrated silicon wafers: Effects of chiplet configuration and area coverage
Muhammad Fikri Shamsuri, Mohd. Zulkifly Abdullah, Mohd Sharizal Abdul Aziz, Krishnamoorthy Ramalingam, Yong Jie Wong, Shaw Fong Wong, Pooi Kit Lam, Bok Eng Cheah
Adv. Sci. Technol. Res. J. 2027; 21(2)
Mathematical Modeling of Stress in Circuit Cards Represented by Mechanical Oscillatory Systems
Adv. Sci. Technol. Res. J. 2022; 16(1):303-315
Empirical Tests of Stress in Gyroplane Rotor During Flight
Adv. Sci. Technol. Res. J. 2020; 14(3):107-117
An influence of low-energy impact loads on a multilayer sandwich composite
Adv. Sci. Technol. Res. J. 2026; 20(8):100-112
Derivation of Material Constants for Experimental SKR-788 Silicone Samples via Simulation Modeling and Laboratory Testing
Vasyl Mykhailiuk, Yevstakhiy Kryzhanivskyy, Yurii Mosora, Ruslan Deineha, Damian Dzienniak, Szymon Bajda, Michał Bembenek
Adv. Sci. Technol. Res. J. 2024; 18(5):268-276
Design of Dry Friction Damper to Reduce Vibration Impacts to Circuit Cards at Critical Frequencies
Adv. Sci. Technol. Res. J. 2024; 18(2):78-87
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