Scores:
10
MNiSW
100
ICV
 
 

IMPACT OF THERMAL FATIGUE ON YOUNG’S MODULUS OF EPOXY ADHESIVES

 
1
Department of Production Engineering, Faculty of Mechanical Engineering, Lublin University of Technology, Nadbystrzycka 36, 20-618 Lublin, Poland
Adv. Sci. Technol. Res. J. 2015; 9(28):103–106
Publish date: 2015-11-27
KEYWORDS:
ABSTRACT:
The following paper presents a comparative analysis of two epoxy-based adhesives: Hysol 9466 and Hysol 3421, prior to and after thermal shock testing. The tests focused on determining Young’s modulus. Epoxy-based materials are among the most widespread adhesive materials used as universal structural adhesives. The prepared epoxy samples (Hysol 9466 and Hysol 3421) were subjected to thermal shock cycling tests, according to a specified programme, in a thermal shock testing chamber, at a temperature range –40 °C to +60 °C and in the number of 200 cycles. Conclusions from the tests are presented at the final stage of the paper.
 
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