This study examines the wettability and wetting kinetics of Cu-Ni and Cu-Cr alloys on Al2O3 substrates using the sessile drop method under high-vacuum and inert-gas conditions. Understanding metal-ceramic wetting behavior is crucial for designing reliable joining processes and metal-ceramic composites based on copper alloys and alumina. Contact angle measurements were performed for Cu-Ni and Cu-Cr alloys using a contact heating approach, complemented by a modified capillary extrusion technique for highly oxidizable alloys. Time-dependent evolution of the contact angle was analyzed to assess wetting kinetics and interfacial stability. The results show that both Cu-Ni and Cu-Cr alloys exhibit poor wettability toward Al2O3, with contact angles remaining in the non-wetting regime (>120°) throughout the experiments. Nickel additions did not improve wettability relative to pure copper, and the contact angle remained essentially constant during the holding time. In the case of the Cu-Cr alloy, severe oxidation resulted in the formation of a stable oxide shell, which prevented the use of conventional sessile drop measurements. Although capillary extrusion enabled droplet deposition at the experimental temperature, rapid passivation limited effective wetting, resulting in asymmetric wetting kinetics. These conclusions demonstrate that alloying copper with Ni or Cr alone is insufficient to promote wetting on alumina under the applied conditions. The study offers valuable insights into the kinetic limitations of Cu-based alloy wetting and highlights the critical role of oxide chemistry and experimental methodology in characterizing metal-ceramic interfaces.